The influence of SMAT processing on microstructure of copper films electroplated in steady-state, reversed impulse and stochastic regimes

V. M. Tiutenko, V. V. Morozovych, V. A. Diduk, S. Kolinko, Yu. O. Lyashenko

Abstract


In the paper we investigate the application of low-frequency mechanical processing by friction (SMAT technology) of copper films to polished polycrystalline copper in steady-state, reversed impulse and stochastic regimes. X-ray diffraction methods were used in order to reveal the influence SMAT processing on microstructure of surface layers of electroplated copper. We found broadening of diffraction peaks measured for electroplated copper, which indicates the grain refinement. The same effect is observed after SMAT processing of surfaces. But in later case this broadening is also due to appearing of microstresses inside the processed surface layers. Obtained results of x-ray analysis allow us to make following conclusions: the textured surface of copper with preferential (220) orientation appears after electroplating. The grains become misoriented again after SMAT processing of the electroplated layer.The binary Cu/Sn diffusion couples were prepared on the basis of various (electroplated and/or SMAT processed) copper substrates. It was found that the average thickness of Cu 3 Sn reaction layer formed at the reaction interface is much lower for the case of SMAT processing of the involved copper substrate.


Keywords


Nanocrystalline materials; intensive plastic deformation; Surface mechnical attrition treatment (SMAT); electroplated copper; copper/tin solid state reactions; X-ray diffraction analysis.

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