STRUCTURAL STATE OF ELECTRODEPOSITED COPPER LAYERS
The aim of this work is a systematic application of hardware software for the production of cooper electrodeposited in stationary, reverse pulse and stochastic modes. Investigation of the influence of different modes of electrodeposition on the microstructure of the surface layers of copper by x-ray diffraction analysis is conducted.
The microstructure of copper layers obtained by electrodeposition in stationary, reverse pulse and stochastic modes on copper substrates was studied by X-ray diffraction analysis. The significant influence of the current form on the texture of the deposited copper layers is established. The size of coherent scattering regions in layers obtained under different current regimes is determined by analyzing the broadening of diffraction lines.
In work the technology of reception of layers of electrodeposition in stationary, reverse pulse and stochastic modes of copper on copper substrates is fulfilled. The control of electrodeposition process, an automated software and hardware system were developed.
The influence of electrodeposition in different modes on the microstructure of the surface layers of copper was studied by X-ray diffraction analysis. The calculations showed that the broadening of the diffraction lines from the samples obtained after electrolytic deposition of copper on copper plates is associated with a decrease in grain size.
The obtained results of structural analysis allow us to draw the following conclusions: under the conditions of stochastic current, a precipitate close to "polycrystal" is formed with a slight tendency to texturing along the direction <110>. In the case of stationary deposition (direct current), regardless of the cathode potential, the sediment texture (110) becomes sharper, as can be seen from the increase in the relative intensity of the copper diffraction line (220). Due to the pulsed reverse mode, the electrolytic precipitate has a pronounced axial texture along the crystallographic direction <110 > perpendicular to the surface of the sample.
The size of coherent scattering regions in electrodeposited layers obtained using the pulsed reverse mode is larger than in other modes. It was also found that after electrolytic deposition of copper grain size decreases compared to the grain size in the polycrystalline copper substrate.
Glaiter H. (2000). Nanostructured materials: basic concepts and microstructure. Acta Materialia, 48, 1-29. – DOI:10.1016/S1359-6454(99)00285-2
Belenkyi M. A., Ivanov A. F. (1985). Electrodeposition of metal coatings: Handbook. Moscow: Metallurgy (in Rus).
Popov K. I. Djokic S. S., Nikolic N. D., Jovic V. D. (2016). Morphology of electrochemically and chemically deposited metals. Switzerland: Springer.
Medvedev A A., Semenov S. (2005). Pulsed metallization of printed circuit boards. Tekhnolohyy V Elektronnoi Promyshlennosty (Technology in the Electronic Industry), 3, 68-70. – Retrieved from http://echemistry.ru/assets/files/stati/impulsnaya_metallizaciya _pp.pdf
Sheshadri B. S., Setty H. V. (1973). The effect of alternating current on the morphology of electrodeposited copper electrodeposition and surface treatment. Electrodeposition and Surface Treatment, 2(74), 223-231. – DOI:10.1016/0300-9416(74)90036-4
Kilimnik A. B. (2008). Electrochemical processes on direct and alternating current. Vestnik TGTU (Bulletin of TSTU), 14(4), 903-916. – Retrieved from http://vestnik.tstu.ru/rus/t_14/pdf/14_4_015.pdf
Stevich Z., Raychich-Vuyasinovich M., Stoilkovich Z. (2003). Control of impulse mode in electroplating. Tekhnologiya i konstruirovaniye v elektronnoy apparature (Technology and design in electronic equipment), 5, 51-52. – Retrieved from http://dspace.nbuv.gov.ua/bitstream/handle/123456789/70700/15StevichNEW.pdf?sequence=1
Nіkolenko Yu. V., Diduk V. A., Korol Ya. K., Lyashenko Y. O. (2016). Development and application of the hardware and software complex in the board by the process of electrolytic deposition of copper in the mode of stochastic oscillations. Visnyk Cherkaskoho Universytetu. Seriia «Fizyko-Matematychni Nauky» (Bulletin of Cherkasy University. Series "Physics and Mathematics"), 1, 27-29. – Retrieved from http://physejournal.cdu.edu.ua/article/view/1372/1396
Morozovych V. V., Honda A. R., Lyashenko Yu. O., Korol Ya. D., Liashenko O. Yu., Cserháti С., and Gusak A. M. (2018) Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin. Metallofiz. Noveishie Tekhnol., 40(12): 1649—1673. – DOI:10.15407/mfint.40.12.1649
Tiutenko, V. M., Morozovych, V. V., Diduk, V. A., Kolinko, S., & Lyashenko, Y. O. (2018). The influence of SMAT processing on microstructure of copper films electroplated in steadystate, reversed impulse and stochastic regimes. Cherkasy University Bulletin: Physical and Mathematical Sciences, 1, 63-78. – Retrieved from http://physejournal.cdu.edu.ua/article/view/2334/2406.
Rusakov A. A. (1971). X-ray of metals. Moscow: Moscow printing house (in Rus).
Shtol'ts A. K., Medvedev A. I., Kurbatov L. V. (2005). X-ray analysis of microstresses and the size of the regions of coherent scattering in polycrystalline materials. Yekaterinburg: GOUVPO-UTTU-UPI (Yekaterinburg: GO-WEI USTU), 16-17. – Retrieved from https://docplayer.ru/47621595-Rentgenovskiy-analiz-mikronapryazheniy-i-razmera-oblasteykogerentnogo-rasseyaniya-v-polikristallicheskih-materialah.html