PECULIARITIES OF THE NUCLEATION AND GROWTH OF THE INTERMETALLIC PHASES AT SOLDERING: AMBIGUOUS EXPERIMENTAL RESULTS AND RECENT DEVELOPMENTS IN MODELLING

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Published: січ. 14, 2016
Keywords:
soldering, nucleation, growth, phase competition, reliability

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Y. O. Liashenko
<p>Черкаський національний університет імені Богдана Хмельницького</p>

Abstract

The interactions between tin or tin-based alloys (in the solid or liquid state) with a copper substrate are reviewed. The majority of studies show that the η-Cu6Sn5  phase is a first to grow rapidly during reflow. The nucleation sequence of the intermetallics and their growth kinetics depend on the supersaturation of copper in the liquid tin droplet and on the rate of the removal of this supersaturation in the solder ball. The η phase grows by the well-known law of growth with time exponent 1/3 (interface controlled regime) or law of growth with time exponent 1/2 (volume diffusion control) but also obeys to other laws of the growth kinetics during reflow. The successful models that describe the suppression and growth of the intermetallics are reviewed. During solid-state ageing, the experimental results show that the intermetallic growth kinetics, their competition as well as voiding at the interfaces depend on the kind of the Cu substrate, namely its structure.

Article Details

Issue
Vol. 309 No. 16 (2014)
Section
Materials Physics
Author Biography

Y. O. Liashenko, <p>Черкаський національний університет імені Богдана Хмельницького</p>

Кандидат фіз.-мат. наук, доцент, директор навчально-наукового інституту фізики, математики та комп’ютерно- інформаційних систем, Черкаський національний університет імені Богдана Хмельницького, бульв. Шевченка 81, 18031, Черкаси, Україна.

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