DEVELOPMENT OF A TECHNOLOGY FOR CONNECTING COPPER CONTACTS BY MEANS OF ELECTROCONDUCTIVE SINTERING OF COPPER POWDERS
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Abstract
Powder metallurgy and the sintering of metal powders play an important role in the production of copper contacts. However, the choice of sintering method has a significant impact on the quality and reliability of the contact zone. In the context of copper contact production, it is particularly important to consider the advantages of electrospark sintering compared to traditional temperature sintering methods
This article focuses on the development and analysis of the technology for joining copper contacts using electrospark sintering of mixture of copper and tin powders to achieve optimal interconnect characteristics. In this article, a scanning electron microscope (SEM-200) was used to examine the contact zone of the experimental samples after electric spark sintering. It was found that after the electrospark sintering process, a stable contact zone is formed in the case of copper and copper-tin powders.
From the results of the analysis of the contact zone, it can be said that after thermal annealing exist the intermediate phase growth and pore formation, the concentration of voids per unit surface area of the contact zone.
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References
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