STUDY OF THE CONTACT ZONE OBTAINED BY ELECTROSPARK SINTERING OF COPPER POWDERS COATED WITH TIN
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Abstract
Powder metallurgy and the sintering of metal powders play an important role in the production of copper contacts. However, the choice of sintering method has a significant impact on the quality and reliability of the contact zone. In the context of copper contact production, it is particularly important to consider the advantages of electrospark sintering compared to traditional temperature sintering methods.
This article focuses on the development and analysis of a technology for joining copper contacts using electrospark sintering of copper powders coated with a thin tin layer to achieve optimal interconnect characteristics. In this article, the contact zone of the experimental samples after electric spark sintering and thermal annealing was studied using a scanning electron microscope REM-200.
From the results of the analysis of pore formation in the contact zone, it can be said that after thermal annealing, the concentration of voids per unit surface area of the contact zone of the sample increases significantly. There is a process of pore redistribution, large conglomerates of pores are crushed, but the pores are more evenly distributed spatially.
The analysis of diffractograms and SEM-images allows us to conclude that a two-phase zone of Cu and Cu3Sn is formed in the contact zone of the test samples
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References
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