TIUTENKO, V. M.; MOROZOVYCH, V. V.; DIDUK, V. A.; KOLINKO, S.; LYASHENKO, Y. O. The influence of SMAT processing on microstructure of copper films electroplated in steady-state, reversed impulse and stochastic regimes. Cherkasy University Bulletin: Physical and Mathematical Sciences, [S. l.], v. 1, n. 1, 2018. Disponível em: https://phys-ejournal.cdu.edu.ua/article/view/2334. Acesso em: 30 may. 2026.