Gusak A. М.; TITOVA, A. NEW THERMODYNAMIC APPROACHES TO FAILURE ANALYSIS IN MICROELECTRONIC MATERIALS. Cherkasy University Bulletin: Physical and Mathematical Sciences, [S. l.], v. 1, n. 1, p. 33–46, 2022. DOI: 10.31651/2076-5851-2022-33-46. Disponível em: https://phys-ejournal.cdu.edu.ua/article/view/4878. Acesso em: 3 may. 2026.