Tiutenko, V. M., V. V. Morozovych, V. A. Diduk, S. Kolinko, and Yu. O. Lyashenko. “The Influence of SMAT Processing on Microstructure of Copper Films Electroplated in Steady-State, Reversed Impulse and Stochastic Regimes”. Cherkasy University Bulletin: Physical and Mathematical Sciences 1, no. 1 (April 9, 2018). Accessed May 30, 2026. https://phys-ejournal.cdu.edu.ua/article/view/2334.