Model of phase growth in a binary system under electromigration when there is a diffusion interaction between the anode and cathode

S. V. Kornienko

Abstract


The model of the growth of a new phase in the binary system, with the existence of diffuse interactions between the cathode and anode, through a common layer of solder has been considered. The numerical modeling shows that the flow of substances between the electrodes through a solder joint layer due to electromigration, increases the rate of phase growth at the anode and weakens it at the cathode comparing to the case when a transport of material between the electrodes is missing. The greater the current density, the stronger the effect of the joint solder layer on kinetics of the phases growth. Calculations show that taking into account the actions of the sources/sinks of vacancies in the diffusion zone can significantly change the rate of a phase growth at the cathode and the anode.

Keywords


reaction diffusion; electromigration; non-equilibrium vacancies; phase growth kinetics; binary system

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