Model of phase growth in a binary system under electromigration when there is a diffusion interaction between the anode and cathode

##plugins.themes.bootstrap3.article.sidebar##

PDF (English)
Опубліковано: Mar 12, 2017
Ключові слова:
reaction diffusion, electromigration, non-equilibrium vacancies, phase growth kinetics, binary system

##plugins.themes.bootstrap3.article.main##

S. V. Kornienko

Анотація

The model of the growth of a new phase in the binary system, with the existence of diffuse interactions between the cathode and anode, through a common layer of solder  has been considered. The numerical modeling  shows that the flow of substances between the electrodes through a solder joint layer due to  electromigration, increases the rate of phase growth at the anode and weakens it at the cathode  comparing to the case when a transport of material between the electrodes is missing. The greater the current density, the stronger the effect of the joint solder layer on kinetics of the phases growth. Calculations show that taking into account the actions of the sources/sinks of vacancies in the diffusion zone can significantly change the rate of a phase growth at the cathode and the anode.

##plugins.themes.bootstrap3.article.details##

Номер
Том 389 № 1 (2016)
Розділ
ФІЗИКА МАТЕРІАЛІВ

Посилання

Tu K. N. (2003). Recent advances on electromigration in very-large-scaleintegration

of interconnects. Journal of Applied Physics, 94, 5451 – 5473.

Chen C., Tong H.M., Tu K.N. (2010). Electromigration and thermomigration in Pbfree

flip-chip solder joints. Annu.Rev.Mater.Res.,40, 531-555.

Huang M., .Zhang Z., Zhou S., Chen L. (2014). Stress relaxation and failure of Cu-

0Ag-0.5Cu flip-chip solder bumps undergoing electromigration. Mater.Res,. 29(21), 2556-

Gan H., Tu K. N. (2005). Polarity effect of electromigration on kinetics of

intermetallic compound formation in Pb-free solder V-groove samples Journal of Applied

Physics. 97, 063514.

An R., Tian Y., Zhang R., Wang C. (2015). Electromigration-induced intermetallic

growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds

(IMCs)/Cu joints. J Mater Sci:Mater.Electron,.26, 2674 – 2681.

Gan H., Choi W. J., Xu G., Tu K. N. (2002). Electromigration in Solder Joints and

Solder Lines. JOM, 54, 34-37.

Chen C. M., Chen S.W. (2001). Electromigration effect upon the Sn–0.7 wt%

Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions. Journal of Applied Physics. 90, 1208 –

Chao B., Chae S., Zhang X., Lu K. Im J., Ho P. S. (2007). Investigation of

diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free

solders using simulated annealing. Acta Materialia. 55, 2805 – 2814.

Chen S. W., Chen C. M. (2003), Electromigration effects upon interfacial reactions.

JOM. 55, 62 – 67.

Huang M.L., Zhow S.M., Chen L.D. (2012). Electromigration-induced

interfacial reactions in Cu/Sn/Electroless Ni-P Solder Interconnects. J. Electron. Mater.,

(4), 730-740.

Gurov K.P., Gusak A.M. (1987). On the theory of phase growth in the diffusion

zone during mutual diffusion in an external electric field. Fizika metallov i Metallovedenie

(Physics of metals and Metallography), 52(4),767-773.

Gusak A.M., Kornienko. S.V. (2007). Phase formation during electromigration.

Visnyk Cherkaskoho universytetu, seriia fizyko – matematychni nauky. (Bulletin of Cherkasy

University). 114, 11 –38.

Kornienko S.V., Gusak A.M. (2009). The cooperative effect of Electromigration

and Non-Equilibrium Vacancies on Reactive Phase Growth. Philosophical Magazine. 89(9),

-534.

Kornienko. S.V. (2015). Electromigration effects on reaction diffusion in a binary

system with non-equilibrium vacancies. Visnyk Cherkaskoho universytetu, seriia fizyko –

matematychni nauky. (Bulletin of Cherkasy University). 349, 89 –98.