MODEL OF POROUS CU3SN FORMATION BY THE FLUX-DRIVEN CELLULAR PRECIPITATION

A. M. Gusak

Abstract


Just discovered new morphology formation (porous Cu3Sn with lamellar structure) is discussed. Several possible explanations are compared. The most reasonable seems to be an explanation by the new-developed theory of Flux Driven Precipitation in open system. Simple formulae for prediction of the lamellar structure parameters and of the propagation velocity are obtained and compared with experiment. Comparison seems to be quite reasonable.


Keywords


sold state reaction; diffusion; void; phase competition; soldering

References


1. Thin Films-Interdiffusion and Reactions / eds. : J. M. Poate, K. N. Tu, J. W. Mayer. – New York : Wiley, 1978. – P. 305–358.
2. Gusak A. M. Diffusion-controlled Solid State Reactions: in Alloys, Thin Films, and Nanosystems / A. M. Gusak, T. V. Zaporozhets, Yu. O. Lyashenko, S. V. Kornienko, M. O. Pasichnyy, A. S. Shirinyan. – Berlin : Wiley-VCH, 2010.
3. Slezov V. V. Kinetics of First-order Phase Transitions / V. V. Slezov. – BerlinWeinheim : Wiley-VCH, 2009.
4. Gusak A. M. Kinetic theory of flux-driven ripening / A. M. Gusak, K. N. Tu // Physical Review B. – 2002. – Vol. 66. – P. 15403–16.
5. Tu K. N. Linear rate of grain growth in thin films during deposition / K. N. Tu, A. M. Gusak, I. Sobchenko // Physical Review B.– 2003. – Vol. 67. – P. 45408–15.
6. Gusak A. M. Flux-driven nucleation at interfaces during reactive diffusion / Andriy M. Gusak, Fiqiri Hodaj, Guido Schmitz // Philosophical Magazine Letters. – 2011. – Vol. 91, №10. – С. 610–620.
7. Turnbull D. Theory of cellular precipitation / D. Turnbull // Acta Met. – 1955. – Vol. 3. – P. 55.
8. Hillert M. On theories of growth during discontinuous precipitation / M. Hillert // Metal. Trans. – 1972. – Vol. 3. – P. 2729–2741. – (doi:10.1007/BF02652840).
9. Cahn J. W. The kinetics of cellular segregation reactions / J. W. Cahn. – Acta Met. – 1959. – Vol. 7. – P. 18.
10. Panchenko I. Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects / I. Panchenko, K. Croes, I De Wolf et al. // Microelectronic Engineering. – 2014. – Vol. 117. – P. 26–34.
11. Chiu W. L. Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization / W. L. Chiu, C. M. Liu, Y. S. Haung, C. Chen // Applied Physics Letters. – 2014. – Vol. 104. – P. 171902–12.


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