STRUCTURAL STATE OF ELECTRODEPOSITED COPPER LAYERS
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Abstract
The aim of this work is a systematic application of hardware software for the production of cooper electrodeposited in stationary, reverse pulse and stochastic modes. Investigation of the influence of different modes of electrodeposition on the microstructure of the surface layers of copper by x-ray diffraction analysis is conducted.
The microstructure of copper layers obtained by electrodeposition in stationary, reverse pulse and stochastic modes on copper substrates was studied by X-ray diffraction analysis. The significant influence of the current form on the texture of the deposited copper layers is established. The size of coherent scattering regions in layers obtained under different current regimes is determined by analyzing the broadening of diffraction lines.
In work the technology of reception of layers of electrodeposition in stationary, reverse pulse and stochastic modes of copper on copper substrates is fulfilled. The control of electrodeposition process, an automated software and hardware system were developed.
The influence of electrodeposition in different modes on the microstructure of the surface layers of copper was studied by X-ray diffraction analysis. The calculations showed that the broadening of the diffraction lines from the samples obtained after electrolytic deposition of copper on copper plates is associated with a decrease in grain size.
The obtained results of structural analysis allow us to draw the following conclusions: under the conditions of stochastic current, a precipitate close to "polycrystal" is formed with a slight tendency to texturing along the direction <110>. In the case of stationary deposition (direct current), regardless of the cathode potential, the sediment texture (110) becomes sharper, as can be seen from the increase in the relative intensity of the copper diffraction line (220). Due to the pulsed reverse mode, the electrolytic precipitate has a pronounced axial texture along the crystallographic direction <110 > perpendicular to the surface of the sample.
The size of coherent scattering regions in electrodeposited layers obtained using the pulsed reverse mode is larger than in other modes. It was also found that after electrolytic deposition of copper grain size decreases compared to the grain size in the polycrystalline copper substrate.
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References
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