MODELING OF VOID DISTRIBUTION BY SIZE AT THE DIFFUSION ZONE
Main Article Content
Abstract
At the interdiffusion and reaction diffusion which happens on the vacancy atomic diffusion mechanism, the inequality of atoms fluxes is caused by their differential mobility, give rise to a directional flux of vacancies. This flux of vacancies cause an appearance of areas in a diffusion zone with supersaturation and deficiency in vacancies, where sinks / sources of non-equilibrium vacancies act. The proposed model of void formation takes into account existence two types of sinks / sources of non-equilibrium vacancies, depending on their location: in the phase volume and at the interfacial boundaries. It is believed that the voids arise with a certain periodicity near the interfacial boundary, where there is a vacancy supersaturation due to the different mobility of the components. The voids move in volume of growing phase, their sizes change. The void radius increases as long as void is in the region of the diffusion zone where there is a vacancy supersaturation. The void radius begins to decrease if the void is in the area of the diffusion zone, where there is a negative vacancy supersaturation (the concentration of vacancies is less than the equilibrium) until it disappears. The simulation of void size distribution along the diffusion zone during the reaction diffusion process for a binary system is performed. The simulation results show that the work efficiency of vacancies sources/sinks affects not only the rate of void growth, but also the shape of the pore size distribution and their maximum size. In addition, each type of vacancies sources/sinks has a different effect on the kinetics of void formation. Thus, the more work efficiency of vacancies sources/sinks in the phase volume, the wider the void formation area (the area where the voids exist) and the smaller the difference between pore sizes.
Article Details
References
Tu K. N. (2003). Recent advances on electromigration in very-large-scale-integration of interconnects. Journal of applied physics, 94(9), 5451-5473. Retrieved from https://doi.org/10.1063/1.1611263
Gan H., Tu K. N. (2005). Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples. Journal of applied physics, 97(6), 063514. Retrieved from https://doi.org/10.1063/1.1861151
Huang M., Zhang Z., Zhou S., Chen L. (2014). Stress relaxation and failure behavior of Sn–3.0 Ag–0.5 Cu flip-chip solder bumps undergoing electromigration. Journal of Materials Research, 29(21), 2556-2564. Retrieved from https://doi.org/10.1557/jmr.2014.231
An R., Tian Y., Zhang R., Wang C. (2015). Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics, 26(5), 2674-2681.: Retrieved from https://doi.org/ 10.1007/s10854-015-2736-6
Hsu H. L., Lee H., Wang C. W., Liang C., Chen C. M. (2019). Impurity evaporation and void formation in Sn/Cu solder joints. Materials Chemistry and Physics, 225, 153-158. Retrieved from https://doi.org/10.1016/j.matchemphys.2018.12.036
Hurov K. P., Husak A. M. (1985) Gurov, K.P., & Gusak, A.M. (1985). Description of mutual diffusion in alloys with an arbitrary power of vacancy sinks. Fyzyka metallov y metallovedenye, 59(6), 1062-1066 (in Russ.)
Husak A. M. (1992) Linear phase growth and nonequilibrium vacancies. Metallofyzyka (NANU), 14(9), 3-6 (in Russ.)
Korniienko S. V. (2010) Influence of sources and vacancies at maternal phases on the kinetics of dysfunction reaction in binary systems Visnyk Cherkaskoho Universytetu. Seriia «Fizyko-Matematychni Nauky» (Bulletin of Cherkasy University. Series "Physics and Mathematics"), (185), 39-47 (in Russ.)
Kornyenko S. V. (2013) A model of reaction diffusion in a binary system that takes into account the action of sources and drains of vacancies in maternal phases. Metallofyzyka y noveishye tekhnolohy, 35(12), 1685-1696 (in Russ.) Retrieved from http://irbis-nbuv.gov.ua/cgi-bin/irbis_nbuv/cgiirbis_64.exe?C21COM=2&I21DBN=UJRN&P21DBN=UJRN&IMAGE_FILE_DOWNLOAD=1&Image_file_name=PDF/MPhNT_2013_35_12_11.pdf
Kornyenko S. V., Husak A. M. (2015) The influence of sources and sinks of vacancies on the kinetics of reaction diffusion in a binary system. Metallofyzyka y noveishye tekhnolohy,37(10), 1001-1016 (in Russ.) Retrieved from http://irbis-nbuv.gov.ua/cgi-bin/irbis_nbuv/cgiirbis_64.exe?C21COM=2&I21DBN=UJRN&P21DBN=UJRN&IMAGE_FILE_DOWNLOAD=1&Image_file_name=PDF/MPhNT_2015_37_10_3.pdf
Storozhuk N. V., Husak A. M. (2014) Competition of the Frenkel and Kirkendall effects in mutual diffusion. Metallofyzyka y noveishye tekhnolohyy, 36(3), 367-374. (in Russ.) Retrieved from http://irbis-nbuv.gov.ua/cgi-bin/irbis_nbuv/cgiirbis_64.exe?C21COM=2&I21DBN=UJRN&P21DBN=UJRN&IMAGE_FILE_DOWNLOAD=1&Image_file_name=PDF/MPhNT_2014_36_3_8.pdf
Zaporozhets T. V., Storozhuk N. V., Gusak A. M. (2016) Competition of Voiding and Kirkendall Shift during Compound Growth in Reactive Diffusion–Alternative Models. Metallofyzyka y noveishye tekhnolohyy,. 38(10), 1279-1292. Retrieved from https://doi.org/10.15407/mfint.38.10.1279
Kolisnyk L. I., Korniienko S. V. (2018) Modeling porn growth in reaction diffusion in a binary system. Visnyk Cherkaskoho Universytetu. Seriia «Fizyko-Matematychni Nauky» (Bulletin of Cherkasy University. Series "Physics and Mathematics"), (185), 39-47. Retrieved from http://phys-ejournal.cdu.edu.ua/article/view/3344/3720