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The microstructure of copper layers obtained by electrodeposition in stationary, pulsed and stochastic modes on copper substrates was studied by means of scanning electron microscopy. It was found that the shape of the applied grains differs significantly in the case of pulsed and stationary application modes.
The technology of production of electrodeposited layers in stationary, pulse and stochastic modes of copper on copper substrates is worked out in the work. The developed automated software and hardware complex was used to control the electrodeposition process.
The effect of electrodeposition in different modes on the structure of copper surface layers was investigated using scanning electron microscopy. Qualitative examination of SEM images of electrodeposited surfaces showed that in the case of stochastic and stationary modes of electrodeposition, a coating with a larger grain size is formed than in the case of pulsed deposition.
It should also be noted that the shape of the applied grains is significantly different in the case of pulsed and stationary application modes. In the process of electrodeposition in the stationary mode, sediment is formed in the form of conglomerates of grains of different sizes, while in the pulse mode, a uniform grain structure is formed. The shape of the grains formed in the process of electrodeposition in the stochastic mode is different in that the coating has areas with evenly distributed grains and conglomerates of grains.
The average grain size in the electrodeposited layers obtained using the pulse mode increases with increasing pulse period. It was also found that the average grain size is smaller in the case of the stochastic application method than in the case of the pulsed method, for the same average current density