EFFECT OF ULTRASOUND ON THE PROCESS OF CHEMICAL DEPOSITION OF TIN ON COPPER POWDER
Main Article Content
The influence of ultrasonic mixing on the process of chemical deposition of tin on powdered copper was investigated. It was established that the use of an ultrasonic disperser in the process of chemical deposition of tin on copper powder affects the rate of growth of the Cu6Sn5 phase. The phase composition of the powders obtained during the chemical deposition of tin was analyzed and a quantitative analysis of the phases formed after the process of chemical deposition of tin on copper powder was carried out.
An ultrasonic disperser using a powerful ultrasonic emitter was developed for the process of chemical deposition of tin on copper. The manufactured samples were examined using a modified REM-200 scanning electron microscope and a DRON-2 diffractometer. The produced powders were previously pressed in a press mold with a force of 150 kgf/cm2.
The phase composition of the prepared samples was investigated using X-ray diffractometry. Analysis of diffractograms of powders of chemically deposited tin on copper showed that the phase composition of all samples is the same. However, the intensities of the peaks of the diffractograms of the samples are different, from this it follows that the quantitative ratio between the phases in each of the samples is different.
Qualitative examination of SEM images of surface samples also showed that in different regimes of chemical deposition of tin on copper powder, the ratio between the phase areas is different. In the case of using an ultrasonic disperser in the process of chemical deposition of tin, the percentage of Sn was 40% and 49%, in the sample where ultrasonic mixing was not used, the percentage of Sn was 9%. Also, the content of the Cu6Sn5 phase is the highest in the sample that was not exposed to ultrasonic mixing and is 61%.
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