THE INFLUENCE OF EXTERNAL PRESSURE ON THE KINETICS OF PHASE GROWTH IN THE CU-SN-CU SYSTEM
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Abstract
In the conducted study, the kinetics of phase growth in the Cu-Sn-Cu system under conditions of isothermal annealing at a temperature (250°C) were investigated. In addition, the effect of external pressure on the process of growth or inhibition of the phase and the formation of pores was studied. The main goal of the study was to determine the influence of external pressure on the thickness of the Cu3Sn and Cu6Sn5 phase during certain periods of annealing time of the system.
After the experiment, the obtained data were processed and analyzed. The thickness of the Cu3Sn and Cu6Sn5 phases was processed for two test samples: with and without the influence of external pressure. For this purpose, the values of the phase thickness at different stages of system annealing were measured. After the calculation, graphs were drawn that show the dependence of the phase thickness on the annealing time for both systems.
The results of the experiment showed that the external pressure significantly slows down the growth of the Cu3Sn and Cu6Sn5 phases in the studied system. Graphs of changes in phase thickness from annealing time showed a noticeable difference between the studied samples.
This research has an important practical application in the field of materials science and metallurgy. Because during the creation of a soldered joint, reactive diffusion occurs between copper and liquid tin, as a result of which two phases are formed at their contact. In the process of its growth, in turn, pores are formed, which can affect the mechanical and electrical properties of the contact and serve as places for the nucleation of defects, which cause the electrical connections of the circuit elements to fail. That is why the findings can help to improve the technology of making soldered joints, ensuring better quality and their mechanical properties.
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References
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