MODELS OF PHASE FORMATION, GROWTH AND COMPETITION IN SOLDERING - SOME NEW RESULTS

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Keywords:
diffusion, intermetallics, growth kinetics, tin-based solders, grain boundary wetting

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A. M. Gusak
O. Yu. Liashenko
Fiqiri Hodaj

Abstract

Simple phenomenological models of formation, competition and growth of the
intermediate Cu-Sn phases during soldering are presented. The first attempt to estimate the width of liquid channels between scallops of Cu6Sn5 phase is suggested. Also, an attempt to take into account the change of scallops shape (aspect ratio) with modeling of the Cu6Sn5 growth is made.

Article Details

Issue
Vol. 269 No. 16 (2013)
Section
Materials Physics

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