Investigation of the growth kinetics of the intermetallic compound in the system copper - tin with electromigration
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Abstract
Experimental study of the growth kinetics of a new phase in the copper–tin system at an electronic transport is carried out. It is shown that the phase growth on the anode is faster as compared with that on the cathode. The phase growth kinetics on the electrodes corresponds to a linear time law. In these experiments, the anode and cathode have no common contact through the solder layer. This eliminates the diffusion of copper atoms from the cathode to the anode. If the anode and cathode have common contact through the solder layer, then the phase growth kinetics on the electrodes corresponds to a parabolic time law.
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References
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